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The AVP incorporates the latest Qualcomm QCS8550, the most advanced mobile processor chip from the leader in mobile, automotive, and robotics system-on-chip (SoC) technology. The AVP provides best-in-class artificial intelligence (AI) performance within a small, lightweight, and low-power module for thermal and visible camera integration into unmanned aerial vehicles, robots, small gimbals, handheld devices, and fixed mounted security systems.\u003C\u002Fp>\r\n\u003Cp style=\"text-align: left;\">AVP runs the Teledyne FLIR Prism AI and ISP software libraries and interfaces with the Boson® and Neutrino® thermal infrared imaging camera modules and a wide range of popular visible cameras. Trained on the world’s largest thermal image data lake of more than 5 million annotations, Prism AI is a powerful perception software designed to detect, classify, and track targets or objects for automotive autonomy, automotive automatic emergency braking, airborne camera payloads, counter-drone systems, ground intelligence, surveillance and reconnaissance (ISR), and perimeter security. Prism ISP is a comprehensive set of image processing algorithms that include super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local-contrast enhancement, and noise reduction.\u003C\u002Fp>\r\n\u003Cp>“The new AVP is the most powerful and SWaP-optimized processor on the market today, running AI workloads up to five times faster than competitive offerings,” said Dan Walker, Vice President - Product Management, Teledyne FLIR. “The combination of powerful edge computing and our Prism digital solutions ushers in a new era of electro-optical system capabilities while simplifying development and reducing integration risk.”\u003C\u002Fp>\r\n\u003Cp>The AVP is designed to empower integrators to build powerful, edge-intelligent products. It is supported by several tools to simplify and streamline development, including a Qualcomm RB5 development kit. Software and board-support packages are also available to enable developers to design and fabricate custom interface boards that meet each product’s specific form, fit, function, and input-output (IO) requirements.\u003C\u002Fp>\r\n\r\n\u003Cp>For more information: \u003Cstrong>www.flir.com\u003C\u002Fstrong>\u003C\u002Fp>","https:\u002F\u002Fmedia.magicwandmedia.in\u002Fposts\u002FJune2024\u002FdZsg76PIHU2BrcyrQKcd.jpg","https:\u002F\u002Fmedia.magicwandmedia.in\u002Fsocial\u002Fhorizontal\u002Fposts\u002FJune2024\u002FdZsg76PIHU2BrcyrQKcd.jpg","2024-06-20T02:33:20+05:30",0,"Teledyne FLIR launched its new AVP, an advanced video processor designed for high-performance edge AI applications in thermal and visible imaging.\nThe AVP utilizes the Qualcomm QCS8550 processor to offer superior speed and power efficiency for drones, robotics, and security systems.\nBuilt-in Prism AI software provides advanced target detection and classification capabilities using a vast library of thermal image data.","The landscape of edge computing is evolving rapidly. Teledyne FLIR has officially unveiled its new Advanced Video Processor (AVP), featuring the Qualcomm QCS8550. This compact, low-power module is set to redefine how we approach thermal and visible camera integration in high-stakes industries like automotive autonomy, counter-drone systems, and ground surveillance. By combining the power of the QCS8550 with Teledyne FLIR’s proprietary Prism AI software, developers can now achieve AI workloads up to five times faster than existing competitive solutions. This innovation represents a major step forward in reducing integration risk while maximizing the intelligence of unmanned vehicles and robotics. How will this level of edge-intelligent processing impact your future infrastructure deployments? Let us know in the comments. #EdgeAI #TeledyneFLIR #RoboticsTechnology","Teledyne FLIR levels up edge intelligence! The new AVP, powered by Qualcomm, delivers 5x faster AI performance for thermal and visible imaging systems. 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