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Decarbonization Agenda","cii-greenpro-summit-2026-drives-indias-industrial-decarbonization-agenda","CII GreenPro Summit 2026 accelerates India's industrial decarbonization with focus on green products and sustainable value chains.","https:\u002F\u002Fmedia.magicwandmedia.in\u002Fposts\u002FJuly2026\u002Fnews\u002Fcii-greenpro-summit-2026-drives-indias-industrial-decarbonization-agenda-dlMTv5.png","2026-07-31T03:24:02+05:30",{"title":56,"slug":57,"excerpt":58,"imageUrl":59,"publishedAt":60,"author":11,"category":12},"BASF Launches Melyra and Inveris Gold Crop Protection Solutions in India","basf-launches-melyra-and-inveris-gold-crop-protection-solutions-in-india","BASF expands its Indian agricultural portfolio with the launch of Melyra and Inveris Gold, delivering advanced crop protection and enhanced 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MTPA","tembo-global-industries-opens-new-vasai-facility-boosts-capacity-to-100000-mtpa","Tembo Global Industries scales up! Discover how their new 100,000 MTPA Vasai facility drives engineering innovation and infrastructure growth.","https:\u002F\u002Fmedia.magicwandmedia.in\u002Fposts\u002FJuly2026\u002Fnews\u002Ftembo-global-industries-opens-new-vasai-facility-boosts-capacity-to-100000-mtpa-0tSB5k.png","2026-07-31T02:07:26+05:30",{"title":74,"slug":75,"excerpt":76,"imageUrl":77,"publishedAt":78,"author":11,"category":12},"N.A.N. MagneTech to Invest INR 1,250 Cr in NdFeB Magnet Plant","nan-magnetech-to-invest-inr-1250-cr-in-ndfeb-magnet-plant","N.A.N. 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Radiometry, the ability to take the temperature of every pixel, as well as both MIPI and CMOS interfaces, are now also available on all resolutions. With these updates and a thermal sensitivity of 20 millikelvin (mK) or less, Boson+ is the most sensitive longwave infrared (LWIR) camera line in the market and is ideal for integration in unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), automotive, wearables, security applications, handhelds, and thermal sights.\u003C\u002Fp>\r\n\u003Cp>Made in the USA, the Boson+ features 640 x 512 and now 320 x 256 resolutions, utilizing the latest 12-micron pixel pitch thermal detector within a size, weight, and power (SWaP) optimized package. The noise equivalent differential temperature (NEDT) of 20 mK or less offers enhanced detection, recognition, and identification (DRI) performance, especially in low-contrast and low-visibility environments. With improved automatic gain control (AGC) and video latency compared to previous iterations of Boson, the Boson+ delivers dramatically enhanced scene contrast and sharpness while improving tracking, seeker performance, and decision support.\u003C\u002Fp>\r\n\u003Cp>Boson+ customers gain access to the US-based Teledyne FLIR Technical Services team for integration support, which reduces development risk and shortens time to market. Designed for integrators, the Boson+ is available with a variety of lens options, comprehensive product documentation, an easy-to-use SDK, and a user-friendly GUI. Boson+ is dual use and classified under the US Department of Commerce’s jurisdiction as EAR 6A003.b.4.a. The Teledyne FLIR Boson+ is available for purchase globally from Teledyne FLIR and its authorized dealers.\u003C\u002Fp>\r\n\u003Cp>“Boson+ is in volume manufacturing and is a drop-in upgrade for systems designed with Boson, making upgrades low-risk and plug-and-play simple,” said Dan Walker, Vice President, Product Management, OEM Cores, Teledyne FLIR. “With customer-selectable USB, CMOS, or MIPI video interfaces, it is now easier than ever to integrate Boson+ with a wide range of embedded processors from Qualcomm, Ambarella, and more.”\u003C\u002Fp>\r\n\r\n\u003Cp>For more information: \u003Cstrong>www.teledyne.com\u003C\u002Fstrong>\u003C\u002Fp>","https:\u002F\u002Fmedia.magicwandmedia.in\u002Fposts\u002FApril2023\u002Fdm6oOgKh9uuiLINozIFO.jpg","https:\u002F\u002Fmedia.magicwandmedia.in\u002Fsocial\u002Fhorizontal\u002Fposts\u002FApril2023\u002Fdm6oOgKh9uuiLINozIFO.jpg","2023-04-26T05:57:47+05:30",0,"Teledyne FLIR expanded the Boson+ thermal camera line with 24 new compact models featuring 320 x 256 resolution.\nThe updated series offers industry-leading 20mK thermal sensitivity for superior detection in low-visibility environments.\nNew MIPI and CMOS interface options allow for seamless integration with a wide range of modern embedded processors.","Teledyne FLIR is raising the bar for thermal imaging technology. Their latest update to the Boson+ thermal camera module line introduces 24 new models, offering 320 x 256 resolution and critical radiometry capabilities. Engineered for integrators, these modules provide a 20mK thermal sensitivity, making them the most sensitive LWIR cameras currently on the market. With the addition of MIPI and CMOS interfaces, the Boson+ is now more compatible than ever with embedded processors from industry leaders like Qualcomm and Ambarella. This drop-in upgrade path is designed to shorten development timelines and reduce integration risks for UAS, automotive, and security sectors. It is a powerful step forward for developers looking to optimize SWaP without sacrificing performance. How is your team leveraging high-resolution thermal data in your current projects? #ThermalImaging #Engineering #TeledyneFLIR #MachineVision","Teledyne FLIR’s upgraded Boson+ thermal camera series just got more powerful. With new 320x256 resolution and MIPI interface support, it’s a game-changer for UAS and industrial integration. #ThermalImaging #TeledyneFLIR","Big news for the thermal imaging space! 📸 Teledyne FLIR just announced a massive update to their Boson+ camera modules. We’re talking 24 new compact models, new resolution options, and expanded interface support including MIPI and CMOS. 🚀\n\nDesigned for integrators, these modules are all about boosting detection, recognition, and identification (DRI) performance—even in the toughest low-contrast environments. Whether you’re working on UAS, wearables, or autonomous systems, this is a major win for your SWaP-optimized designs. Ready to take your thermal integration to the next level? 🌡️✨\n\n#TeledyneFLIR #ThermalImaging #EngineeringTech #UAS #Innovation #TechNews #EmbeddedSystems",{"title":145,"description":147,"keywords":158},"teledyne flir, thermal camera, boson+, infrared technology, thermal imaging, oem camera modules, machine vision, lwir, uas technology, embedded systems",{"title":160,"slug":161,"imageUrl":162},"Mitsubishi Electric India Supports Sustainable Development Through Education & Healthcare CSR Initiatives","mitsubishi-electric-india-supports-sustainable-development-through-education-healthcare-csr-initiatives","https:\u002F\u002Fmedia.magicwandmedia.in\u002Fposts\u002FApril2023\u002FFsAYf5Hy0vGqiJXWiNkp.JPG",{"title":164,"slug":165,"imageUrl":166},"Q.ANT Showcased Fully Integrated Quantum Sensing Technology at Hannover 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